| CoolRunner™-II Family | ||||||||
|---|---|---|---|---|---|---|---|---|
| Part Number | XC2C32A | XC2C64A | XC2C128 | XC2C256 | XC2C384 | XC2C512 | ||
| Logic Resources | System Gates | 750 | 1500 | 3000 | 6000 | 9000 | 12000 | |
| Macrocells | 32 | 64 | 128 | 256 | 384 | 512 | ||
| Product Terms Per Macrocell | 56 | 56 | 56 | 56 | 56 | 56 | ||
| Clock Resources | Global Clocks | 3 | 3 | 3 | 3 | 3 | 3 | |
| Product Term Clocks Per Function Block | 16 | 16 | 16 | 16 | 16 | 16 | ||
| I/O Resources | Maximum I/O | 33 | 64 | 100 | 184 | 240 | 270 | |
| Input Voltage Compatible | 1.5/1.8/2.5/3.3 | 1.5/1.8/2.5/3.3 | 1.5/1.8/2.5/3.3 | 1.5/1.8/2.5/3.3 | 1.5/1.8/2.5/3.3 | 1.5/1.8/2.5/3.3 | ||
| Output Voltage Compatible | 1.5/1.8/2.5/3.3 | 1.5/1.8/2.5/3.3 | 1.5/1.8/2.5/3.3 | 1.5/1.8/2.5/3.3 | 1.5/1.8/2.5/3.3 | 1.5/1.8/2.5/3.3 | ||
| Speed Grades | Min. Pin-to-Pin Logic Delay (ns) | 3.8 | 4.6 | 5.7 | 5.7 | 7.1 | 7.1 | |
| Commercial Speed Grades (Fastest to Slowest) | -4, -6 | -5, -7 | -6, -7 | -6, -7 | -7, -10 | -7, -10 | ||
| Industrial Speed Grades (Fastest to Slowest) | -6 | -7 | -7 | -7 | -10 | -7¹, -10 | ||
| Package² | Area³ | Maximum User I/Os | ||||||
| QFN Packages (QFG): Quad, flat, no-lead (0.5 mm lead spacing) | ||||||||
| QF32(4) | 5 x 5 mm | 21 | ||||||
| QF48⁴ | 7 x 7 mm | 37 | ||||||
| VQFP Packages (VQ): Very thin QFP (VQ44: 0.8 mm lead spacing, VQ100: 0.5 mm lead spacing) | ||||||||
| VQ44 | 12 x 12 mm | 33 | 33 | |||||
| VQ100 | 16 x 16 mm | 64 | 80 | 80 | ||||
| Chip Scale Packages (CP): Wire-bond, chip-scale, BGA (0.5 mm ball spacing) | ||||||||
| CP56 | 6 x 6 mm | 33 | 45 | |||||
| CP132 | 8 x 8 mm | 100 | 106 | |||||
| TQFP Packages (TQ): Thin QFP (0.5 mm lead spacing) | ||||||||
| TQ100 | 16 x 16 mm | |||||||
| TQ144 | 22 x 22 mm | 100 | 118 | 118 | ||||
| PQFP Packages (PQ): Wire-bond, plastic, QFP (0.5 mm lead spacing) | ||||||||
| PQ208 | 30.6 x 30.6 mm | 173 | 173 | 173 | ||||
| FGA Packages (FG): Wire-bond, fine-pitch, BGA (1.0 mm ball spacing) | ||||||||
| FT256 | 17 x 17 mm | 184 | 212 | 212 | ||||
| FBGA Packages (FG): Wire-bond, fine-line, BGA (1.0 mm ball spacing) | ||||||||
| FG324 | 23 x 23 mm | 240 | 270 | |||||
| Note: | 1. -7 speed grade is only available in FT(G)256 package. | |||||||
| 2. All packages are available in Pb-Free and RoHS6 compliantversions. | ||||||||
| 3. Area dimensions for lead-frame product are inclusive of theleads. | ||||||||
| 4. Only available in RoHS6 compliant and Halogen-freepackages. | ||||||||
| XC9500XL Family | ||||||
|---|---|---|---|---|---|---|
| Part Number | XC9536XL | XC9572XL | XC95144XL | XC95288XL | ||
| Logic Resources | System Gates | 800 | 1600 | 3200 | 6400 | |
| Macrocells | 36 | 72 | 144 | 288 | ||
| Product Terms Per Macrocell | 90 | 90 | 90 | 90 | ||
| Clock Resources | Global Clocks | 3 | 3 | 3 | 3 | |
| Product Term Clocks Per Function Block | 18 | 18 | 18 | 18 | ||
| I/O Resources | Maximum I/O | 36 | 72 | 117 | 192 | |
| Input Voltage Compatible | 2.5/3.3/5 | 2.5/3.3/5 | 2.5/3.3/5 | 2.5/3.3/5 | ||
| Output Voltage Compatible | 2.5/3.3 | 2.5/3.3 | 2.5/3.3 | 2.5/3.3 | ||
| Speed Grades | Min. Pin-to-Pin Logic Delay (ns) | 5 | 5 | 5 | 6 | |
| Commercial Speed Grades (Fastest to Slowest) | -5, -7, -10 | -5, -7, -10 | -5, -7, -10 | -6, -7, -10 | ||
| Industrial Speed Grades (Fastest to Slowest) | -7, -10 | -7, -10 | -7, -10 | -7, -10 | ||
| Package² | Area³ | Maximum User I/Os | ||||
| VQFP Packages (VQ): Very thin QFP (VQ44: 0.8 mm lead spacing, VQ64: 0.5 mm lead spacing) | ||||||
| VQ44 | 12 x 12 mm | 34 | 34 | |||
| VQ64 | 12 x 12 mm | 36 | 52 | |||
| PLCC Packages (PC): Wire-bond, plastic, chip carrier (1.27 mm lead spacing) | ||||||
| PC44 | 17.5 x 17.5 mm | 34 | 34 | |||
| Chip Scale Packages (CS): Wire-bond, chip-scale, BGA (0.8 mm ball spacing) | ||||||
| CS48 | 7 x 7 mm | 36 | 38 | |||
| CS144 | 12 x 12 mm | 33 | 45 | 117 | ||
| CS280 | 16 x 16 mm | 192 | ||||
| TQFP Packages (TQ): Thin QFP (0.5 mm lead spacing) | ||||||
| TQ100 | 16 x 16 mm | 72 | 81 | |||
| TQ144 | 22 x 22 mm | 117 | 117 | |||
| PQFP Packages (PQ): Wire-bond, plastic, QFP (0.5 mm lead spacing) | ||||||
| PQ208 | 30.6 x 30.6 mm | 168 | ||||
| FGA Packages (FG): Wire-bond, fine-pitch, BGA (1.0 mm ball spacing) | ||||||
| FT256 | 17 x 17 mm | 192 | ||||
| FBGA Packages (FG): Wire-bond, fine-line, BGA (1.0 mm ball spacing) | ||||||
| FG324 | 23 x 23 mm | 192 | ||||
| Note: | 1. All packages are available in Pb-Free and RoHS6 compliant versions. | |||||
| 2. Area dimensions for lead-frame product are inclusive of the leads. | ||||||